FROM EXPERIMENTAL RESEARCH METHODS: ADVANTAGES AND DISADVANTAGES OF THE MAGNETRON SPUTTERING METHOD
DOI:
https://doi.org/10.5281/zenodo.20049106Keywords:
magnetron sputtering, thin films, plasma, vacuum technology, sputtering, semiconductors, electronics, metal oxidesAbstract
Magnetron sputtering vacuum deposition (MSVD) has undergone significant development since its
inception. This review examines the evolution of MSVD, its fundamental principles, various techniques (including jet
sputtering, pulsed magnetron sputtering, and high-power pulsed magnetron sputtering), and its wide range of industrial
applications.
While highlighting key advantages such as high deposition rates, versatility in material selection, and precise control
over film properties, the review also addresses inherent challenges, including low target utilization and plasma instability.
A significant portion of the study focuses on the important role of MSVD in the automotive industry, emphasizing its
application in producing durable, high-quality coatings for both aesthetic and functional purposes.
In addition, the transition from traditional electroplating methods to environmentally sustainable MSVD technologies
is discussed, reflecting the growing demand for cleaner and more efficient manufacturing processes.
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